Pad on Beer (Permanent Hole Filling)
Supports plate thickness up to 4.8t! We can achieve permanent hole filling for Via according to customer requests.
We offer "Pad on Via (permanent filling)" services. We support the manufacturing of pad on vias in the BGA and CSP areas. The filling of pad on vias can accommodate board thicknesses up to 4.8t. Additionally, the permanent filling ink is processed smoothly through polishing, allowing us to achieve permanent filling of vias according to customer requests. 【Features】 ■ Supports the manufacturing of pad on vias in the BGA and CSP areas ■ Filling of pad on vias can accommodate board thicknesses up to 4.8t ■ Achieves permanent filling of vias according to customer requests ■ Permanent filling ink is processed smoothly through polishing *For more details, please refer to the PDF document or feel free to contact us.
- Company：スクリーンプロセス
- Price：Other
